Degryse, DominiekDominiekDegryseStoukatch, SergueiSergueiStoukatchVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7482Mechanical behavior of BEOL structures containing lowK dielectrics during bonding processProceedings paper