Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications

Gonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeVanfleteren, JanJanVanfleterenManessis, DionysiosDionysiosManessis2021-10-162021-10-162005-06https://imec-publications.be/handle/20.500.12860/10505Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applicationsProceedings paper