Characterization of extreme Si thinning proces for wafer-to-wafer stacking

Inoue, FumihiroFumihiroInoueJourdain, AnneAnneJourdainDe Vos, JoeriJoeriDe VosPeng, LanLanPengLiebens, MaartenMaartenLiebensArmini, SilviaSilviaArminiUedono, AkiraAkiraUedonoRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyne, EricEricBeyneSleeckx, ErikErikSleeckx2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26765Characterization of extreme Si thinning proces for wafer-to-wafer stackingProceedings paperhttp://ieeexplore.ieee.org/document/7545713/?arnumber=7545713