Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics

Phommahaxay, AlainAlainPhommahaxayDe Wolf, IngridIngridDe WolfDjuric, TatjanaTatjanaDjuricHoffrogge, PeterPeterHoffroggeBrand, SebastienSebastienBrandCzurratis, PeterPeterCzurratisPhilipsen, HaroldHaroldPhilipsenBeyer, GeraldGeraldBeyerStruyf, HerbertHerbertStruyfBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24386Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristicsProceedings paperhttp://dx.doi.org/10.1109/ECTC.2014.6897385