Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects

Fang, YuYuFangCiofi, I.I.CiofiRoussel, Ph. J.Ph. J.RousselLesniewska, A.A.LesniewskaCarballo, V. M. BlancoV. M. BlancoCarballoDegraeve, R.R.DegraeveWolf, I. DeI. DeWolfCroes, K.K.Croes2025-05-012025-05-012025-APR 70018-9383WOS:001470958000001https://imec-publications.be/handle/20.500.12860/45574Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch InterconnectsJournal article10.1109/TED.2025.3554474WOS:001470958000001CHALLENGES