Advances in temporary carrier technology for high density fan-out device build-up

Podpod, ArnitaArnitaPodpodPhommahaxay, AlainAlainPhommahaxayBex, PieterPieterBexSlabbekoorn, JohnJohnSlabbekoornBertheau, JulienJulienBertheauSalahouelhadj, AbdellahAbdellahSalahouelhadjSleeckx, ErikErikSleeckxMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneGuerrero, AliceAliceGuerreroYess, KimKimYessArnold, KimKimArnold2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33813Advances in temporary carrier technology for high density fan-out device build-upProceedings paperhttps://ieeexplore.ieee.org/document/8811142