Ivankovic, AndrejAndrejIvankovicCherman, VladimirVladimirChermanVandevelde, BartBartVandeveldeVan der Plas, GeertGeertVan der PlasRebibis, Kenneth JuneKenneth JuneRebibisLa Manna, AntonioAntonioLa MannaBeyne, EricEricBeyneDe Wolf, IngridIngridDe WolfVandepitte, DirkDirkVandepitte2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19111Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuitsProceedings paper