Funaya, TakuoTakuoFunayaBuisson, ThibaultThibaultBuissonDe Preter, IngeIngeDe PreterBeyne, EricEricBeyneIker, FrancoisFrancoisIker2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17120Ultra thin die embedding technology with 20um-pitch interconnectionProceedings paper