Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization

Satta, AlessandraAlessandraSattaBeyer, GeraldGeraldBeyerMaex, KarenKarenMaexElers, K.K.ElersHaukka, S.S.HaukkaVantomme, AndreAndreVantomme2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5632Properties of TiN thin films deposited by ALCVD as barriers for Cu metallizationProceedings paper