Vandooren, AnneAnneVandoorenWu, ZhichengZhichengWuKhaled, AhmadAhmadKhaledFranco, JacopoJacopoFrancoParvais, BertrandBertrandParvaisLi, W.W.LiWitters, LiesbethLiesbethWittersWalke, AmeyAmeyWalkePeng, LanLanPengRassoul, NouredineNouredineRassoulMatagne, PhilippePhilippeMatagneJamieson, GeraldineGeraldineJamiesonInoue, FumihiroFumihiroInoueNguyen, B.Y.B.Y.NguyenDebruyn, HaroenHaroenDebruynDevriendt, KatiaKatiaDevriendtTeugels, LieveLieveTeugelsHeylen, NancyNancyHeylenVecchio, EmmaEmmaVecchioZheng, T.T.ZhengRadisic, DunjaDunjaRadisicRosseel, ErikErikRosseelVanherle, WendyWendyVanherleHikavyy, AndriyAndriyHikavyyChan, BTBTChanBesnard, G.G.BesnardSchwarzenbach, W.W.SchwarzenbachGaudin, G.G.GaudinRadu, IulianaIulianaRaduWaldron, NiamhNiamhWaldronDe Heyn, VincentVincentDe HeynDemuynck, StevenStevenDemuynckBoemmels, JuergenJuergenBoemmelsRyckaert, JulienJulienRyckaertCollaert, NadineNadineCollaertMocuta, DanDanMocuta2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34309Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applicationsProceedings paper