Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules

Maestre Caro, ArantxaArantxaMaestre CaroTravaly, YoussefYoussefTravalyMaes, GuidoGuidoMaesBorghs, GustaafGustaafBorghsArmini, SilviaSilviaArmini2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19353Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM moleculesProceedings paper