Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints

Ratchev, PetarPetarRatchevLabie, RietRietLabieBeyne, EricEricBeyne2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9496Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder jointsProceedings paper