Inductive links for 3D stacked chip-to-chip communication

Sun, XiaoXiaoSunPantano, NicolasNicolasPantanoKim, Soon-WookSoon-WookKimVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34085Inductive links for 3D stacked chip-to-chip communicationProceedings paperhttps://ieeexplore.ieee.org/document/8811205