Richard, EmmanuelEmmanuelRichardVervoort, IwanIwanVervoortBrongersma, SywertSywertBrongersmaBender, HugoHugoBenderBeyer, GeraldGeraldBeyerPalmans, RogerRogerPalmansLagrange, SébastienSébastienLagrangeMaex, KarenKarenMaex2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4692Roles of additives during filling process of damascene structures with electrochemical deposited copperProceedings paper