Bex, PieterPieterBexWang, TengTengWangCherman, VladimirVladimirChermanLofrano, MelinaMelinaLofranoCapuz, GiovanniGiovanniCapuzSleeckx, ErikErikSleeckxBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27843Thermal compression bonding: understanding heat transfer by in situ measurement and modelingProceedings paper