Chi, Chun-ChuanChun-ChuanChiMarinissen, Erik JanErik JanMarinissenGoel, Sandeep KumarSandeep KumarGoelWu, Cheng-WenCheng-WenWu2021-10-192021-10-192011-09https://imec-publications.be/handle/20.500.12860/18681Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer baseProceedings paper