Vaes, JanJanVaesCotrin Teixeira, RicardoRicardoCotrin TeixeiraSwinnen, BartBartSwinnen2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14591Wafer thinning and planarization tech-nology for 3D InterconnectsProceedings paper