Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications

Wei, TiweiTiweiWeiOprins, HermanHermanOprinsCherman, VladimirVladimirChermanYang, Z.Z.YangRivera, K.K.RiveraVan der Plas, GeertGeertVan der PlasPawlak, BartekBartekPawlakEngland, L.L.EnglandBeyne, EricEricBeyneBaelmans, M.M.Baelmans2022-01-252021-11-022022-01-2520200569-5503WOS:000620983200213https://imec-publications.be/handle/20.500.12860/38154Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die ApplicationsProceedings paper10.1109/ECTC32862.2020.00225978-1-7281-6180-8WOS:000620983200213