Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10

Luhn, OleOleLuhnRadisic, AlexAlexRadisicVereecken, PhilippePhilippeVereeckenVan Hoof, ChrisChrisVan HoofRuythooren, WouterWouterRuythoorenCelis, Jean-PierreJean-PierreCelis2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/15766Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10Meeting abstract