Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures

Donaton, R. A.R. A.DonatonCoenegrachts, BartBartCoenegrachtsMaenhoudt, MireilleMireilleMaenhoudtPollentier, IvanIvanPollentierStruyf, HerbertHerbertStruyfVanhaelemeersch, SergeSergeVanhaelemeerschGrillaert, JoostJoostGrillaertFyen, WimWimFyenBeyer, GeraldGeraldBeyerStucchi, MicheleMicheleStucchiRichard, EmmanuelEmmanuelRichardVervoort, IwanIwanVervoortDe Roest, DavidDavidDe RoestMaex, KarenKarenMaex2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4344Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structuresOral presentation