Duval, FabriceFabriceDuvalSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSwinnen, BartBartSwinnenSoussan, PhilippePhilippeSoussan2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13686Polymer deep trench filling for Through Silicon Via technologyMeeting abstract