Vandevelde, BartBartVandeveldeIvankovic, AndrejAndrejIvankovicDebecker, BjornBjornDebeckerLofrano, MelinaMelinaLofranoVanstreels, KrisKrisVanstreelsGuo, WeiWeiGuoCherman, VladimirVladimirChermanGonzalez, MarioMarioGonzalezVan der Plas, GeertGeertVan der PlasDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyneTokei, ZsoltZsoltTokei2021-10-222021-10-2220140026-2714https://imec-publications.be/handle/20.500.12860/24729Chip-package interaction in 3D stacked IC packages using finite element modellingJournal articlehttp://www.sciencedirect.com/science/article/pii/S0026271414000833