Die-to-Die and Die-to-Wafer bonding solutions for high density, fine pitch micro-bumped die

Lecarpentier, GilbertGilbertLecarpentierDe Vos, JoeriJoeriDe Vos2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20995Die-to-Die and Die-to-Wafer bonding solutions for high density, fine pitch micro-bumped dieProceedings paper