Characterization of WF6/N2/H2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization

Li, HuaHuaLiJin, S.S.JinBender, HugoHugoBenderLanckmans, FilipFilipLanckmansHeyvaert, IlseIlseHeyvaertMaex, KarenKarenMaexFroyen, L.L.Froyen2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4528Characterization of WF6/N2/H2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallizationJournal article