Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder joint

Salenbien, R.R.SalenbienCote, R.R.CoteGoossens, J.J.GoossensLimaye, PareshPareshLimayeLabie, RietRietLabieGlorieux, C.C.Glorieux2021-10-192021-10-1920110021-8979https://imec-publications.be/handle/20.500.12860/19719Laser-based surface acoustic wave dispersion spectroscopy for extraction of thicknesses, depth, and elastic parameters of a subsurface layer: Feasibility study on intermetallic layer structure in integrated circuit solder jointJournal article