Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects

Wu, C.C.WuVaisman Chasin, AdrianAdrianVaisman ChasinDemuynck, StevenStevenDemuynckHoriguchi, NaotoNaotoHoriguchiCroes, KristofKristofCroes2021-11-252021-11-022021-11-242021-11-2520201541-7026WOS:000612717200031https://imec-publications.be/handle/20.500.12860/38205Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line InterconnectsProceedings paper978-1-7281-3199-3WOS:000612717200031