A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Iacovo, SerenaSerenaIacovoD'have, KoenKoenD'haveOkudur, Oguzhan OrkutOguzhan OrkutOkudurDe Vos, JoeriJoeriDe VosUhrmann, ThomasThomasUhrmannPlach, ThomasThomasPlachConard, ThierryThierryConardMeersschaut, JohanJohanMeersschautBex, PieterPieterBexBrems, StevenStevenBremsPhommahaxay, AlainAlainPhommahaxayGonzalez, MarioMarioGonzalezWitters, LiesbethLiesbethWittersBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2023-11-292023-10-232023-11-2920230569-5503WOS:001047624100233https://imec-publications.be/handle/20.500.12860/42914A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer WarpageProceedings paper10.1109/ECTC51909.2023.00241979-8-3503-3498-2WOS:001047624100233