Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits

Marinissen, Erik JanErik JanMarinissenFodor, FerencFerencFodorPodpod, ArnitaArnitaPodpodStucchi, MicheleMicheleStucchiJian, Yu-RongYu-RongJianWu, Cheng-WenCheng-WenWu2021-10-252021-10-252018-11https://imec-publications.be/handle/20.500.12860/31290Solutions to multiple probing challenges for test access to multi-die stacked integrated circuitsProceedings paperhttps://ieeexplore.ieee.org/document/8626258