Thermo-mechanical stress induced by CPI on 3D interposer package

Lofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalez2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24161Thermo-mechanical stress induced by CPI on 3D interposer packageProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813821&contentType=Conference+Publications