How significant will be the test cost share for 3D die-to-wafer stacked ICs?

Taouil, MottaqiallahMottaqiallahTaouilHamdioui, SaidSaidHamdiouiMarinissen, Erik JanErik JanMarinissen2021-10-192021-10-192011-04https://imec-publications.be/handle/20.500.12860/19869How significant will be the test cost share for 3D die-to-wafer stacked ICs?Proceedings paperhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5941432