An efficient bump pad design to mitigate the flip chip package induced stress

Gonzalez, MarioMarioGonzalezDe Vos, JoeriJoeriDe VosVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25324An efficient bump pad design to mitigate the flip chip package induced stressProceedings paper