Araga, YuukiYuukiAragaNagata, MakotoMakotoNagataDe Vos, JoeriJoeriDe VosVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-252021-10-2520181349-2543https://imec-publications.be/handle/20.500.12860/30141A study on substrate noise coupling among TSVs in 3D chip stackJournal articlehttps://doi.org/10.1587/elex.15.20180460