Removal of submicrometer particles from silicon wafer surfaces using HF-based cleaning mixtures

Vos, RitaRitaVosLux, MarcelMarcelLuxXu, KaidongKaidongXuFyen, WimWimFyenKenens, ConnyConnyKenensConard, ThierryThierryConardMertens, PaulPaulMertensHeyns, MarcMarcHeynsHatcher, Z.Z.HatcherHoffman, M.M.Hoffman2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5823Removal of submicrometer particles from silicon wafer surfaces using HF-based cleaning mixturesJournal article