Declercq, JakobJakobDeclercqNiu, ShengpuShengpuNiuNiels, MargotMargotNielsShahin, AmirAmirShahinvan Kerrebrouck, JorisJorisvan KerrebrouckBillet, MaximilienMaximilienBilletBerciano, MathiasMathiasBercianoLambrecht, JorisJorisLambrechtMoeneclaey, BartBartMoeneclaeyVanackere, TomTomVanackereVissers, EwoudEwoudVissersCoughlan, ConorConorCoughlanRoelkens, GuntherGuntherRoelkensMoerman, ArnoArnoMoermanCaytan, OlivierOlivierCaytanLemey, SamSamLemeyChakrabarti, MaumitaMaumitaChakrabartiKobbi, HakimHakimKobbiKim, MinkyuMinkyuKimYudistira, DiditDiditYudistiraLoo, RogerRogerLooBipul, SwetanshuSwetanshuBipulFerraro, FilippoFilippoFerraroBan, YoojinYoojinBanDe Heyn, PeterPeterDe HeynTorfs, GuyGuyTorfsBauwelinck, JohanJohanBauwelinckVelenis, DimitriosDimitriosVelenisOssieur, PeterPeterOssieurAbsil, PhilippePhilippeAbsilKuyken, BartBartKuykenvan Campenhout, JorisJorisvan CampenhoutSingh, NishantNishantSinghBruynsteen, CedricCedricBruynsteenYin, XinXinYinVan Kerrebrouck, JorisJorisVan Kerrebrouck2026-05-282026-05-282025979-8-3315-9532-6https://imec-publications.be/handle/20.500.12860/59451We demonstrate a 2 km 160 GBd PAM-4 O-band link with traveling-wave drivers and TIAs co-packaged with a new high-responsivity 100 GHz Ge photodetector and transfer printed TFLN MZMs on a silicon photonics platformeng320 Gb/s Unamplified Transmission using 100 GHz Ge PD and TFLN MZM on a Foundry-Compatible SiPh Platform Co-Packaged with Traveling-Wave Drivers and TIAsProceedings paper10.1109/ecoc66593.2025.11263113WOS:001680185000191