Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package

Andersson, CristinaCristinaAnderssonVandevelde, BartBartVandeveldeNoritake, ChikageChikageNoritakeSun, PPSunTegehall, Per-ErikPer-ErikTegehallAndersson, DagDagAnderssonWetter, GGWetterLiu, JohanJohanLiu2021-10-172021-10-1720090954-0911https://imec-publications.be/handle/20.500.12860/14900Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA packageJournal article