Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding

Nagano, FuyaFuyaNaganoIacovo, SerenaSerenaIacovoPhommahaxay, AlainAlainPhommahaxayInoue, FumihiroFumihiroInoueSleeckx, ErikErikSleeckxDe Gendt, StefanStefanDe GendtBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-292021-10-292020https://imec-publications.be/handle/20.500.12860/35637Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bondingProceedings paperhttps://iopscience.iop.org/article/10.1149/09804.0021ecst