Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique

Christiaens, FilipFilipChristiaensVandevelde, BartBartVandeveldeBeyne, EricEricBeyneRoggen, JeanJeanRoggen2021-09-292021-09-291996https://imec-publications.be/handle/20.500.12860/1118Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation techniqueJournal article