FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers

Op de Beeck, MaaikeMaaikeOp de BeeckVerplancke, RikRikVerplanckeSchaubroeck, DavidDavidSchaubroeckLi, ChangzhengChangzhengLiCuypers, DieterDieterCuypersCauwe, MaartenMaartenCauweVandecasteele, BjornBjornVandecasteeleMader, LotharLotharMaderVanhaverbeke, CelineCelineVanhaverbekeO'Callaghan, JohnJohnO'CallaghanBraeken, DriesDriesBraekenAndrei, AlexandruAlexandruAndreiFirrincieli, AndreaAndreaFirrincieliBallini, MarcoMarcoBalliniKundu, AritraAritraKunduFahmy, AhmedAhmedFahmyPatrick, ErinErinPatrickMaghari, NimaNimaMaghariBashirullah, RizwanRizwanBashirullahDe Baets, JohanJohanDe Baets2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33704FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayersProceedings paperhttp://www.imaps.org/abstracts/system/new/abstract_preview.asp?abstract=2019medical008