Void growth modeling upon electromigration stressing in single damascene cu lines

Tio Castro, DavidDavidTio CastroHoofman, RomanoRomanoHoofmanMichelon, JulienJulienMichelonBruynseraede, ChristopheChristopheBruynseraede2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12975Void growth modeling upon electromigration stressing in single damascene cu linesJournal articlehttp://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JAPIAU000102000012123515000001&idtype=cvips&gifs=yes