Pre-bonding characterization of SiCN enabled wafer stacking

Peng, LanLanPengKim, Soon-WookSoon-WookKimIacovo, SerenaSerenaIacovoInoue, FumihiroFumihiroInoueDe Vos, JoeriJoeriDe VosSleeckx, ErikErikSleeckxMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33769Pre-bonding characterization of SiCN enabled wafer stackingProceedings paperhttps://ieeexplore.ieee.org/document/8735126