Impact of mid-bond Testing in 3D stacked ICs

Taouil, MottaqiallahMottaqiallahTaouilHamdioui, SaidSaidHamdiouiMarinissen, Erik JanErik JanMarinissenBhawmik, SudiptaSudiptaBhawmik2021-10-212021-10-212013-10https://imec-publications.be/handle/20.500.12860/23157Impact of mid-bond Testing in 3D stacked ICsProceedings paperhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6653603