Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet Technology

Chen, YukaiYukaiChenMishra, SubratSubratMishraRyckaert, JulienJulienRyckaertBiswas, DwaipayanDwaipayanBiswasMyers, JamesJamesMyers2025-08-032025-08-0320251530-1591WOS:001506972600316https://imec-publications.be/handle/20.500.12860/46020Late Breaking Results: Thermal Feasibility of Backside Integrated LDOs in 2.5D/3D System-in-Package Using Nanosheet TechnologyProceedings paper978-3-9826741-0-0WOS:001506972600316