Through-Silicon Via technology for 3D applications

Philipsen, HaroldHaroldPhilipsenLuhn, OleOleLuhnCivale, YannYannCivaleWang, Yu-ShuenYu-ShuenWangSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanRuythooren, WouterWouterRuythooren2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17807Through-Silicon Via technology for 3D applicationsProceedings paper