Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding

Tsau, Yan WenYan WenTsauDe Messemaeker, JokeJokeDe MessemaekerGonzalez, MarioMarioGonzalezSeefeldt, MarcMarcSeefeldtBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2024-05-062023-10-152024-05-0620232833-8553WOS:001058887300039https://imec-publications.be/handle/20.500.12860/42757Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bondingProceedings paper10.1109/EuroSimE56861.2023.10100784979-8-3503-4597-1WOS:001058887300039