van der Veen, MarleenMarleenvan der VeenInoue, FumihiroFumihiroInoueVandersmissen, KevinKevinVandersmissenDictus, DriesDriesDictusTanaka, TetsuTetsuTanakaBoemmels, JuergenJuergenBoemmelsStruyf, HerbertHerbertStruyfTokei, ZsoltZsoltTokei2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27450Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnectsMeeting abstract