Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

Kirimura, TomoyukiTomoyukiKirimuraCroes, KristofKristofCroesSiew, Yong KongYong KongSiewVanstreels, KrisKrisVanstreelsCzarnecki, PiotrPiotrCzarneckiEl-Mekki, ZaidZaidEl-Mekkivan der Veen, MarleenMarleenvan der VeenDictus, DriesDriesDictusYoon, A.A.YoonKolics, A.A.KolicsBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokei2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22605Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusionProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615555&contentType=Conference+Publications