Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

Carbonell, LaureLaureCarbonellVolders, HennyHennyVoldersHaider, A.A.HaiderHeylen, NancyNancyHeylenRichard, OlivierOlivierRichardPalmans, RogerRogerPalmansTravaly, YoussefYoussefTravalyTokei, ZsoltZsoltTokeiBoelen, PieterPieterBoelenRosenfeld, A.A.RosenfeldMandrekar, T.T.MandrekarHernandez, Jose LuisJose LuisHernandezVanhaelemeersch, SergeSergeVanhaelemeersch2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/11826Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm linesOral presentation