Megasonic, non-contact cleaning followed by "Rotagoni" drying of CMP wafers

Lauerhaas, JeffJeffLauerhaasMertens, PaulPaulMertensNicolosi, T.T.NicolosiKenis, KarineKarineKenisFyen, WimWimFyenHeyns, MarcMarcHeyns2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5431Megasonic, non-contact cleaning followed by "Rotagoni" drying of CMP wafersProceedings paper