Thermal and Mechanical characterization of embedded PTCQ packaging test chip die

Weis, GeraldGeraldWeisSchwarz, TimoTimoSchwarzCherman, VladimirVladimirChermanStahr, HannesHannesStahrVan der Plas, GeertGeertVan der Plas2024-03-112023-10-242024-03-1120230569-5503WOS:001047624100090https://imec-publications.be/handle/20.500.12860/42951Thermal and Mechanical characterization of embedded PTCQ packaging test chip dieProceedings paper10.1109/ECTC51909.2023.00096979-8-3503-3498-2WOS:001047624100090