Recent progress in sequential 3D device stacking: low temperature reliable top tier junction-less devices on 300mm wafers

Vandooren, AnneAnneVandoorenFranco, JacopoJacopoFrancoWu, ZhichengZhichengWuParvais, BertrandBertrandParvaisBesnard, GuillaumeGuillaumeBesnardSchwarzenbach, WalterWalterSchwarzenbachRadu, IonutIonutRaduNguyen, Bich-YenBich-YenNguyenCollaert, NadineNadineCollaert2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34308Recent progress in sequential 3D device stacking: low temperature reliable top tier junction-less devices on 300mm wafersProceedings paper